CSP
Product Description：
Layers: 2 ~ 6 layers
Line width/spacing: 15/15 μm
Minimum finger width/pitch: 35/15 μm
Minimum micro-via/pad diameter: 50/80 μm
Surface treatment: Electroless nickel gold, OSP, etc.
Application area：
Applications: Memory, application processors (AP), RF modules, etc., involving products such as smartphones, televisions, video monitors, and automobiles.
Details
