Layers: 2 ~ 6 layers
Board thickness: 80 ~ 280 μm
Minimum line width/spacing: 12/12 μm
Surface treatment: Nickel palladium gold, OSP, etc.
Bump pitch: 130 μm
SRO: 70 μm
Mostly used for packaging high-end processors in fields like smartphones, tablets, and multimedia devices.
Address: Thinktrans Factory, Jiulonghu Street, Future Road, East Lake High-tech Development Zone, Wuhan
Email: sales@thinktrans.cn
Address: Building A, No. 20 Songtang Road, Tangxiang Community, Yanluo Street, Bao'an District, Shenzhen
Email: sales@thinktrans.cn
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