Layers: 8 ~ 22 layers
Minimum line width/spacing: 8/8 μm
Board thickness: 0.3 mm ~ 2.2 mm
BU Laser/Pad: 50/75 μm
Minimum uBump pitch: 110 μm
Surface treatment: IT/ENEPIG+uBall
Used in computer CPUs, GPUs, MCUs, ASIC specialized chips, etc.
Address: Thinktrans Factory, Jiulonghu Street, Future Road, East Lake High-tech Development Zone, Wuhan
Email: sales@thinktrans.cn
Address: Building A, No. 20 Songtang Road, Tangxiang Community, Yanluo Street, Bao'an District, Shenzhen
Email: sales@thinktrans.cn
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