CORE TECHNOLOGY
Ion Implantation Vapor Deposition
Ion Implantation Vapor Deposition: This unique technology developed by Thinktrans achieves metallization of the substrate surface by injecting metal ions. Unlike traditional chemical copper plating technology, this technique applies ion implantation technology from the semiconductor industry to the carrier board industry. The technology offers superior adhesion between metal and substrate and is more friendly to various materials such as ABF, BT, PI, ceramics, LCP, glass, epoxy resin, etc. It is a green and environmentally friendly
IVD SAP
Ion Implantation Semi-Additive Process (IVD SAP): Based on the IVD technology, this process improves and enhances the existing SAP process. Unlike traditional semi-additive processes, I-SAP has advantages such as thinner seed layers on smooth interfaces, smaller compensations for patterns, more uniform circuitry, higher wiring density, and friendlier high-frequency signal transmission
ROS
RDL on Substrate: This technology, utilizing the IVD process, achieves ultra-fine line widths (<4 μm) on the carrier board. It targets Chiplets and offers carriers with ultra-fine lines, larger areas, and high-frequency and high-speed capabilities. It shares the advantages of I-SAP, such as thinner seed layers on smooth interfaces, smaller compensations for patterns, more uniform circuitry, higher wiring density, and friendlier high-frequency signal transmission.
